1 / 4 www.asb.co.kr june 2009 p lerow tm aln0838at internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount m odule package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 824 849 gain db 20 21 gain flatness db ? 0.2 ? 0.3 noise figure db 0.70 0.75 output ip3 (1) dbm 27 28 s11 / s22 (2) db - 19 / - 9 output p1db dbm 14 1 5 switching time (3) ? sec supply current ma 40 60 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 29 ~ 31 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured with two tones at an output power of +0 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fr om 0 v to v s . pin number function 2 rf in 5 rf out 6 v s other s ground feature s s 21 = 21.2 db @ 824 mh z = 20.8 db @ 849 mhz nf of 0.70 db over fr e quency unconditionally stable single 5v supply high oip3 @ low current c o u pl er note: 1. the number and size of ground via holes in a circuit bo ard is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion c o u pl er c o u pl er c o u pl er c o u pl er (recommended footprint) aln0837at asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) 1 - stage single type description specifications (in pr o duction) typ. @ t = 25 ? c, v s = 5 v, freq. = 836.5 mhz, z o.sys = 50 o hm ou t line drawing (unit: mm) solder stencil area
2 / 4 www.asb.co.kr june 2009 p lerow tm aln0838at internally matched lna module s - param e ters noise figure oip3 p1db 824~849 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 4 www.asb.co.kr june 2009 p lerow tm aln0838at internally matched lna module 1. s - parameter 2. oip3, p1db & nf note: tested at room temperature. 1. s - parameter 2. oip3, p1db & nf note: tested at v s = 5 v . 824 mhz 836.5 mhz 849 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) 4.50 v 21.27 - 21.14 - 10.78 21.08 0.37 - 21.65 - 10.41 20.90 - 21.68 - 10.02 4.75 v 21.36 - 22.19 - 11.14 21.18 0.37 - 22.57 - 10.77 20.99 - 22.29 - 10.35 5.00 v 21.41 - 23.15 - 11.41 21.23 0.37 - 23.30 - 11.03 21.04 - 22.76 - 10.59 5.25 v 21.50 - 24.19 - 11.76 21.32 0.36 - 24.09 - 11.37 21.14 - 23.39 - 10.91 5.50 v 21.55 - 25.09 - 12.02 21.37 0.36 - 24.85 - 11.63 21.19 - 23.83 - 11.17 824 mhz 836.5 mhz 849 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) 4.50 v 27.52 15.24 0.621 26.89 15.19 0.617 27.98 15.15 0.609 4.75 v 28.65 15.62 0.621 28.72 15.63 0.637 28.85 15.57 0.629 5.00 v 29.83 16.02 0.641 29.97 15.95 0.616 30.00 15.86 0.616 5.25 v 30.95 16.19 0.624 31.02 16.22 0 .642 31.18 16.09 0.631 5.50 v 31.10 16.52 0.624 31.13 16.50 0.626 31.25 16.37 0.612 824 mhz 836.5 mhz 849 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) - 45 ? c 21. 75 - 22.45 - 10.89 21.54 0.37 - 21.59 - 10.75 21.38 - 22.52 10.49 - 10 ? c 21.57 - 22.25 - 11.02 21.35 0.38 - 22.34 - 10.98 21.19 - 22.32 - 10.75 25 ? c 21.48 - 22.17 - 11.59 21.29 0.38 - 22.24 - 11.14 21.10 - 22.25 - 10.98 60 ? c 21.30 - 21.71 - 12.00 21.12 0.38 - 21.55 - 11.5 0 21.92 - 21.40 - 11.17 85 ? c 21.22 - 21.02 - 12.21 21.03 0.37 - 21.01 - 11.75 20.85 - 21.15 - 11.36 824 mhz 836.5 mhz 849 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) - 45 ? c 29.68 15.92 0.379 29.23 15.85 0.425 29.57 15.77 0.451 - 10 ? c 29.51 15.85 0.451 29.15 15.72 0.563 29.41 15.65 0.577 25 ? c 29.40 15.81 0.533 29.05 15.63 0.640 29.27 15.59 0.635 60 ? c 28.87 15.38 0.651 28.64 15.14 0.789 28.87 15.22 0.770 85 ? c 28.74 15.23 0.753 28.44 15.06 0.877 28.48 15.17 0.887 rf performance with operating temperature rf performance with voltage change
4 / 4 www.asb.co.kr june 2009 p lerow tm aln0838at internally matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by cus tomer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performance . 2) dc blocking capacitors are always necessarily placed at the input and output port fo r allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are inclu d- ed inside the aln module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e- quency. application circuit recommended soldering reflow process 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) in out vs size 25x25mm (for aln - at, bt, t series C 10x10mm) + - aln out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor evaluation board layout
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